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Reactive ion etching

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{{main|Deep reactive ion etching}}
Deep reactive ion etching (DRIE), while often referring specifically to the [[Wikipedia:Bosch process|Bosch process]], generally is any RIE used to etch high aspect ratio (> 10:1) features. This may be simply a longer, well controlled RIE etch, or may use a specific process such as [[cryogenic etching]] or the [[Wikipedia:Bosch process|Bosch process]]. For all DRIE equipment at the LNF, please refer to the [[:Category:DRIE equipment|list of DRIE equipment]].
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