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Thin film stress measurement

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[[{{PAGENAME}}|{{PAGENAME}}{{#if: {{#var:acronym}} | &nbsp;({{#var:acronym}})|}}]] is calculated based on the change in radius of curvature of a substrate that is caused by the stress in a deposited thin film.
 
==Equipment==
 
=== Flexus 2320-S===
{{main|Flexus 2320-S}}
The Flexus 2320-S uses laser light sources to scan the surface of the wafer in order to measure the radius of curvature of substrates/wafers.
 
=== Dektak XT===
{{main|Dektak XT}}
The Dektak XT uses a stylus in contact with the surface of the wafer to trace the diameter in order to measure the radius of curvature. The Flexus is the primary tool to use for extracting film stress values. The Dektak XT can be used for samples that can't be measured using by using the Flexus (transparent substrates or very rough, non reflective surfaces).
 
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===Complete tool list===
<categorytree mode=pages>{{#var:acronym|{{PAGENAME}}}} equipment</categorytree>
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==Method of operation==
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==Equipment==
=== Flexus 2320-S===
{{main|Flexus 2320-S}}
The Flexus 2320-S uses laser light sources to scan the surface of the wafer in order to measure the radius of curvature of substrates/wafers.
 
=== Dektak XT===
{{main|Dektak XT}}
The Dektak XT uses a stylus in contact with the surface of the wafer to trace the diameter in order to measure the radius of curvature.
 
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===Complete tool list===
<categorytree mode=pages>{{#var:acronym|{{PAGENAME}}}} equipment</categorytree>
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==See also==
Administrator, LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser
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