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[[{{PAGENAME}}|{{PAGENAME}}{{#if: {{#var:acronym}} |  ({{#var:acronym}})|}}]] is a [[chemical vapor deposition]] technology that utilizes a [[plasma deposition|plasma]] to provide some of the energy for the deposition reaction to take place. This provides an advantage of lower temperature processing compared with purely thermal processing methods like low pressure chemical vapor deposition ([[LPCVD]]). PECVD processing temperatures range between 200-400°C. LPCVD processes range between 425-900°C.
 
==Equipment==
===P5000 PECVD===
{{main|P5000 PECVD}}
 
*For processing of pieces up to 150mm wafers
*This is a [[Material restrictions#Semi-clean|semi-clean]] tool and is the most restrictive PECVD tool in regard to substrate materials and materials present on samples that are allowed into the tool.
 
===GSI PECVD===
{{main|GSI PECVD}}
 
*For processing of pieces up to 100mm wafers
*Offers Low Frequency RF for film stress tuning
*This is also a [[Material restrictions#Semi-clean|semi-clean]] tool but has a more relaxed policy on substrate materials that are allowed into the tool including glass wafers, glass slides, and GaAs.
 
===Plasmatherm 790===
{{main|Plasmatherm 790}}
 
*For processing of pieces up to 150mm wafers
*This tool is in the [[Material restrictions#Metals|metals]] material classification and is the least restrictive for materials that are allowed into the tool.
 
===Complete tool list===
<categorytree mode="pages">PECVD equipment</categorytree>
 
==Method of operation==
PECVD deposition materials available in the LNF include: silicon dioxide ([[Silicon dioxide|SiO<sub>2</sub>]]), silicon nitride ([[Silicon nitride|Si<sub>3</sub>N<sub>4</sub>]]), silicon oxynitride [[Oxynitride|SiO<sub>x</sub>N<sub>y</sub>]], and [[amorphous silicon]].
==Equipment==
===P5000 PECVD===
{{main|P5000 PECVD}}
 
*For processing of pieces up to 150mm wafers
*This is a [[Material restrictions#Semi-clean|semi-clean]] tool and is the most restrictive PECVD tool in regard to substrate materials and materials present on samples that are allowed into the tool.
 
===GSI PECVD===
{{main|GSI PECVD}}
 
*For processing of pieces up to 100mm wafers
*Offers Low Frequency RF for film stress tuning
*This is also a [[Material restrictions#Semi-clean|semi-clean]] tool but has a more relaxed policy on substrate materials that are allowed into the tool including glass wafers, glass slides, and GaAs.
 
===Plasmatherm 790===
{{main|Plasmatherm 790}}
 
*For processing of pieces up to 150mm wafers
*This tool is in the [[Material restrictions#Metals|metals]] material classification and is the least restrictive for materials that are allowed into the tool.
 
===Complete tool list===
<categorytree mode="pages">PECVD equipment</categorytree>
==See also==
Administrator, LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser
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