Changes

Jump to navigation Jump to search

Plasmatherm 790/Processes/L nit350

61 bytes removed, 1 year ago
|-
| Deposition Rate
| 427.3 Å9 nm/secmin
|-
| Index of Refraction
| 21.00 ± 0.02999
|-
| Stress
| 50 ± 50 10 MPa
|-
|}
Qualification is done with a 5 minute run, max allowed thickness of 2µm. This recipe has also show to work as a KOH mask.
==Parameters==
OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Bureaucrats, Interface administrators, Administrators, Widget editors
2,126

edits

Navigation menu