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Plasmatherm 790/Processes/L ox350R

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L_OX350R is a 350 C oxide deposition recipe designed to reduce the film roughness by increasing the power. Currently more characterization is needed but roughness as low as 0.23 nm have been seen.
{{expand section|This recipe needs further characterization.}}
[[Category:Processes]]
|authors =
}}
 
 
==Capabilities==
{| class="wikitable" border="1" style="text-align: center"
|-
! Parameter
!
|-
| Deposition Rate
| 6.5 Å/sec
|-
| Index of Refraction
| ?
|-
| Stress
| ? MPa
|-
|}
 
Qualification is done with a 5 minute run, max allowed thickness of 2µm.
==Parameters==
|-
|}
 
==Capabilities==
{| class="wikitable" border="1" style="text-align: center"
|-
! Parameter
!
|-
| Deposition Rate
| 6.5 Å/sec
|-
| Index of Refraction
| ?
|-
| Stress
| ? MPa
|-
|}
 
Qualification is done with a 5 minute run, max allowed thickness of 2µm.
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