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GSI PECVD

89 bytes added, 8 months ago
|overview = [https://docs.google.com/a/lnf.umich.edu/document/d/1qM6qBXAB2DwTyadCRzu_RAS3F1iJkE_y4rrzLL91Rv8/preview System Overview]
|sop = [https://docs.google.com/a/lnf.umich.edu/document/d/1jb4QuGsk1VxW6XAbIobkSpKL8GQ1w4IeZdi5vFHkTRc/preview SOP]
|processes = [https://docs.google.com/a/lnf.umich.edu/spreadsheets/d/1B7g547iesF0Z4T6NLduxVSidUuMjBIJnXk37JGhdpa416H1aYS0FEt4WCMe4svAQBBD3gXRxOs4geAmOHdQi1wA/preview Standard Processes]
|userprocesses = [[LNF_User:{{PAGENAME}}_User_Processes|User Processes]]
|maintenance = [https://docs.google.com/document/d/1gWjGUFD0jdYEUP0Te8fmZ1pSWeNKt0VPTzQ3a7ND5Ac/preview Maintenance]
*Gases
**Standard Gasbox Mounted MFC's
***[[Silane|SI<sub>HSiH<sub>4</sub>]] - 300 sccm***[[Silane|SI<sub>HSiH<sub>4</sub>]] - 5 sccm***[[Oxygen|O<sub>2</sub>]] - 1000 sccm***[[Ammonia|N<sub>HNH<sub>3</sub>]] - 1000 sccm
***[[Nitrous oxide|N<sub>2</sub>O<sub>]] - 2000 sccm
***[[Nitrogen trifluoride|N<sub>FNF<sub>3</sub>]] - 500 sccm
***[[Helium|He<sub>]] - 500 sccm
***[[Nitrogen|N<sub>2</sub>]] - 1000 sccm
**Deposition processes operate between 1.5T to 4.5T
*Chuck
**Heater block 100°C - 350°C (actual substrate temperature is ~15% higher than setpoint)
*RF
**Comdel dual frequency generator-
{{#widget:Iframe
|url=https://docs.google.com/spreadsheets/d/16H1aYS0FEt4WCMe4svAQBBD3gXRxOs4geAmOHdQi1wA/edit#gid=1666953547 1660640889
|width=900
|height=600
#Read through the [https://docs.google.com/a/lnf.umich.edu/document/d/1qM6qBXAB2DwTyadCRzu_RAS3F1iJkE_y4rrzLL91Rv8/preview System Overview] and the [https://docs.google.com/a/lnf.umich.edu/document/d/1jb4QuGsk1VxW6XAbIobkSpKL8GQ1w4IeZdi5vFHkTRc/preview SOP].
#Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training. Please include information on your desired deposition process (films, thicknesses) and a description of your sample (substrate size, substrate material, and materials already present on your sample). Please verify that your substrate material and materials already present on your sample are listed as approved materials in the Material Restrictions (above) and System Overviewsection of the User Manual located at the tool.#A tool engineer will contact you to arrange coordinate a time for initial training.#One or more of these training sessions with your mentor is recommended and final training session with the tool owner will be required before a checkout session can be arranged to gain authorization on the tool.
#Request a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
<!-- Describe standard maintenance/qualification tests here -->
*Chamber maintenance is performed after every 50 75 um's of deposition.
*Following chamber maintenance, a monitor wafer is run on one of the LNF supported standard processes (typically Oxide 200 1500 angstroms) to check tool performance and film characteristics.
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