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Aluminum

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{{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
{{Infobox Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group. ==Processing Equipment==Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.|image ===Deposition Equipment===*[[Lab 18-2]]*[[Enerjet Evaporator]]*[[Angstrom Engineering Evovac Evaporator]]*[[PVD 75 Proline]] |caption ===Etching Equipment=== |category = *[[Acid Bench 12]] - maintained tank|properties =*[[Acid Bench 73]] - Beaker|names =*[[Acid Bench 80]] - Beaker}}*[[LAM 9400]]
A description & relevant information for this material need to be added.===Characterization Equipment===*[[Dektak XT]]
==Applications==
Discuss common uses/applications *Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for this materialoptical devices==Processes=====Depositoin Processes===*[[Electron_beam_evaporation|E-beam evaporation]]
==Processing Tools==Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.*[[Sputter_deposition|Sputter deposition]]
===EquipmentEtch Processes===* List of equipment for processing this material[[Wet etching|Wet etching]]**Wet etching can be used to etch aluminum using [[Aluminum Etch]] at [[Acid Bench 12]], [[Acid Bench 73]], and [[ Acid Bench 80]]. *[[Reactive ion etching]]
===Characterization Processes===* List The profilometer can be used to measure the thickness of chemical (or otherwise) processes for this materialyour deposition.
==References==
*Citations'''Etch rates for micromachining processing''' https://ieeexplore.ieee.org/abstract/document/references 546406*'''Etch rates for this materialmicromachining processing-Part II''' https://ieeexplore.ieee.org/abstract/document/1257354
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