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Aluminum

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Sputter deposition is a physical vapor deposition method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically argon). The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.
===Etch Processes===
====[[Wet Etching|Wet EtchEtching]]====
Wet etching can be used to etch aluminum using [[Aluminum Etch]]
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