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Gold

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{{#vardefine:restriction|3}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
{{Infobox material|image =|caption = |category = |properties =|names =}}Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment. Gold is commonly refereed to by it's atomic symbol Au.
Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment.==Processing Equipment=====Deposition Equipment===*[[Lab 18-2]]*[[Enerjet Evaporator]]*[[Cooke Evaporator]]*[[SJ-20 Evaporator]]*[[Angstrom Engineering Evovac Evaporator]]
===Etching Equipment===
*[[Acid Bench 12]]
*[[Acid Bench 73]]
*[[Acid Bench 82]]
*[[Plasmatherm 790]]
*[[STS Glass Etcher]]
==Applications==
Discuss common uses/applications *Conducting Layer*Bond Pads*Bonding material for this material[[Eutectic bonding]] or [[Thermal Compression bonding]].
==Processing ToolsProcesses==Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections. ===EquipmentDeposition Processes===*Deposition**[[Lab 18Electron_beam_evaporation|E-2beam evaporation]]**[[Enerjet EvaporatorSputter_deposition|Sputter deposition]]**[[Cooke EvaporatorGold Plating]]**[[SJ-20 Evaporator]]**[[SJ-26 Evaporator]]**[[Angstrom Engineering Evovac Evaporator]]*Etching**[[Acid Bench 12]]**[[Acid Bench 73]]**[[Acid Bench 82]]**[[Plasmatherm 790]]**[[STS Glass Etcher]] * List of equipment for processing this material
==Processes==
===Deposition===
====[[Evaporated Gold]]====
====[[Plated Gold]]====
====[[Sputtered Gold]]====
===Etch Processes===
====*[[Wet etching]]====**Wet etching is done by using Transene [[Gold Etch]] 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]
==References==
*[http://en.wikipedia.org/wiki/Gold Wikipedia : Gold]
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