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{{#vardefine:restriction|3}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
{{Infobox material|image =|caption = |category = |properties =|names =}} Gold is generally used for conductive layers and occasionally in bonding applications. Due to its high mobility it is not allowed in most semiconductor equipment. ==Applications==Discuss common uses/applications for this material. ==Processing Tools==Process technologies that can be used to deposit/pattern this material. If this Gold is a substrate, refer commonly refereed to what tool/process restrictions there may be and possibly remove the following sub-sectionsby it's atomic symbol Au.
==Processing Equipment==
===Deposition Equipment===
**[[Lab 18-2]]**[[Enerjet Evaporator]]**[[Cooke Evaporator]]**[[SJ-20 Evaporator]]**[[Angstrom Engineering Evovac Evaporator]]
===Etching Equipment===
**[[Acid Bench 12]]**[[Acid Bench 73]]**[[Acid Bench 82]]**[[Plasmatherm 790]]**[[STS Glass Etcher]]==Applications==*Conducting Layer*Bond Pads*Bonding material for [[Eutectic bonding]] or [[Thermal Compression bonding]].
==Processes=====Deposition Processes===* List of equipment for processing this material[[Electron_beam_evaporation|E-beam evaporation]]*[[Sputter_deposition|Sputter deposition]]*[[Gold Plating]]
====[[Evaporated Gold]]====
====[[Plated Gold]]====
====[[Sputtered Gold]]====
===Etch Processes===
====*[[Wet etching]]====**Wet etching is done by using Transene [[Gold Etch]] 8111. Gold etchant 8111 is a cyanide free based etchant that provides strong definition with minimal undercutting. Gold etchant is potassium iodide and iodine based. You can get a good estimate of etch gold etch rates through other chemicals from ["Etch rates for micromachining processing"] and ["Etch rates for micromachining processing-Part II"]
*[ Wikipedia : Gold]
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