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{{#vardefine:restriction|0}} <!-- Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals, 4 = varies -->
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Aluminum is a metal that is a silvery-white, soft, non-magnetic and ductile in the boron group.
*Discuss common uses/applications for this material. Why this materials is used in the LNF?
==Processing Equipment==
Process technologies that can be used to deposit/pattern this material. If this is a substrate, refer to what tool/process restrictions there may be and possibly remove the following sub-sections.
===Deposition Equipment===
*[[Lab 18-2]]
*[[Acid Bench 12]] - maintained tank
*[[Acid Bench 73]] - Beaker
*[[Acid Bench 8280]] - Beaker
*[[LAM 9400]]
===Characterization Equipment===*[[Dektak XT]] ==Applications==*Aluminum is a commonly deposited metal in the lab. It has a high reflectivity for optical devices. ==Processes=====Depositoin Processes===
*[[Electron_beam_evaporation|E-beam evaporation]]
*[[Sputter_deposition|Sputter deposition]]
===Etch Processes===
*[[Wet etching|Wet etching]]
**Wet etching can be used to etch aluminum using [[Aluminum Etch]] at 50°C at [[Acid Bench 12]], [[Acid Bench 73]], and [[ Acid Bench 80]].
*[[Reactive ion etching]]
===Characterization Processes===
*The profilometer can be used to measure the thickness of your deposition.
*'''Etch rates for micromachining processing'''
*'''Etch rates for micromachining processing-Part II'''
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