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Physical vapor deposition

352 bytes added, 2 years ago
*Higher heat from plasma
|'''Point Source''' - poorer uniformity|'''Larger source''' - better uniformity|-|Rates dependent on melting point + vapor pressure - difficult to do alloys (co-dep recommended. Some compounds dissociate with heating. |Components typically sputter at similar rates when targets are alloyed to start with. Often knock off compounds as molecules.|-
==See also==
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser


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