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YES-CV200RFS(E)

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|chemicals =
|gases = [[Oxygen|O<sub>2</sub>]]<br>[[Argon|Ar]]<br>[[Nitrogen|N<sub>2</sub>]]<br>[[Nitrogen trifluoride|NF<sub>3</sub>]]
|overview = [[{{PAGENAME}}#System_Overview | System Overview]]|sop manual = [https://docs.google.com/document/d/19PctJdqREy4frN86fx64_3rUvEWrNNYzJGmFwif_9781BIA91s15C-1ja4j1KIjTy3KRzyjeq0Fjywk2CdsCTtA/preview SOPUser Manual]|overview = [[{{PAGENAME}}#System_overview | System overview]]|processes = [https://docs.google.com/document/d/1DZ8SI3aaDfWiGep59aFnqrxW6jufzdZ9JXu8U5ckWW4/preview [{{PAGENAME}}#Supported_processes | Supported Processesprocesses]]
|userprocesses =
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
|manufacturer = [http://www.yieldengineering.com/ Yield Engineering Systems]
|model = CV200RFS(E) }}
The [[{{PAGENAME}}]] (referred to as the '''YES Plasma Stripper''' on the [[LNF Scheduler]]) is a single wafer, downstream [[Plasma etching#Plasma_ashing|plasma strip/descum]] tool designed by [http://www.yieldengineering.com/ Yield Engineering Systems]. It is designed for fast plasma stripping of [[photoresist]]s and other organic materials at up to 7000 Å/min. It can also be used for [[surface modification]] and gentle surface cleaning. It supports pieces and wafers from 2” to 8” and wafer pieces. The tool mainly uses [[oxygen]] plasma for organics removal, but it has been configured with three additional process gases ([[Ar]], [[Nitrogen|N<sub>2</sub>]], and [[Nitrogen trifluoride|NF<sub>3</sub>]]), for additional stripping and surface modification techniques.
==Announcements==
'''59/211/2020'''{{note|Several important changes to the operating procedure have been implemented. The new SOP has been placed at Usage of custom recipes on the tool for referencenow require additional training. At this time, all users’ access has been removed. In order to restore your access to Please follow the tool, please review the new SOP and complete the questions instructions in the quiz (both referenced checkout procedure below). We The access code will be reviewing responses weeklychanged on October 1, but if you urgently need 2020 and any users who have not completed the procedure will no longer have access to the tool, please also create a helpdesk ticketrecipe editor.|reminder}}* [https://docs.google.com/document/d/1GzEZMMOQftr7JyJfj8uesD_3cbGWVE3AN4Rg6y9DbKI/preview SOP[{{PAGENAME}}#Super_user_checkout_procedure | Checkout procedure]* [https://docs.google.com/forms/d/e/1FAIpQLSeATwiGb6Xcj3qkHTf-itgDM6iodjWYsyetlaP8LlrjiuNbrA/viewform?usp=sf_link Quiz]
==Capabilities==
* [[Fluorocarbon]] removal in high aspect ratio structures
==System Overviewoverview=====Hardware Detailsdetails===
* Downstream RF plasma: up to 1000 W
* Heated chuck: 30°C – 200°C
* Gases: O<sub>2</sub>, Ar, N<sub>2</sub>, NF<sub>3</sub>
===Substrate Requirementsrequirements===
* Handles up to 8” wafers and wafer pieces
* Single wafer processing(or dual 4" wafers)
* Max sample thickness: 3 mm
===Material Restrictionsrestrictions===[[File:Etch_material_layers.png|right|diagram of typical material stack during an etch]]The {{material restrictionsPAGENAME}} is designated as a [[{{#switch: {{#var:restriction}} | 1 = CMOS Clean | 2 = Semi-Clean| 3 = Metals | 4 = General| Undefined}}]] class tool. A full list of approved materials is included at the end of this section. In addition to the restrictions in this list, materials can be classified into four categories, detailed below: materials that may be '''etched''', materials that can be used as '''masks''', '''etch stop''' materials, and '''buried''' materials. Use of any material outside of these conditions requires approval by the LNF staff via a helpdesk ticket.
====Materials etched====Any ''lab supported'' [[photoresist]] may be etched in this tool. Other approved polymers include PDMS, parylene, and polyimide. The tool may also be used to clean wafers (no etched film). For etching any materials other than these, LNF approval is required via a helpdesk ticket. ====Mask and etch stop materials====This includes any material that will be exposed to the plasma during the process. Materials listed in the Approved materials list are allowed. Any other materials must be approved by the LNF via a helpdesk ticket. ====Approved materials====Below is a list of approved materials for the tool. ''Approved'' means the material is allowed in the tool under the conditions described above. If a material is not listed, please create a helpdesk ticket or email [mailto:info@umich.edu info@lnf.umich.edu] for any material requests or questions. <div class="NavFrame" style="font-size:100%;margin:0;border-style:none;padding:0;"> <div class="NavFrame" style="border-style:solid;background:#fff;padding:0.2em;"> <div class="NavHead" style="background:#ddd;text-align:center;">{{Big|Approved materials}}</div> <div class="NavContent" style="text-align:left;">{{#widget:ApprovedMaterials|toolid={{#var:toolid}}{{{1|}}}|header=N}}</div> </div></div> ==Supported Processesprocesses== The tool is provided with 6 characterized recipes, shown in the table below. Three of these Process time is chosen on the main panel before starting the recipe. The original process times for recipes (31, 2, 5 and 6) 4 have variable times that you can change to suit your needsbeen included for reference. If you need process adjustment beyond this, please consult a tool engineer before creating a recipe to be authorized to edit recipes, and please do not save over the 6 supported recipes. There are 12 recipe slots in total, please save your recipe to one of 7-12. We cannot guarantee that it will be there for your next run, so remember to write down your settings.
{| class="wikitable" border="1" style="text-align: center"
! colspan="2" | Strip photoresist
! colspan="2" | Descum
! Strip KMPR
|-
! (prev) 3 μm !! any !! (prev) 200 Å !! any !! any
|-
! Recipe # !! 1 !! 2 !! 3 !! 4 !! 5!! 6
|-
| '''Time (sec)''' || (prev) 300 || (prev) 360 || var. || (prev) 20 || var. || var.
|-
| '''Chuck temp. (°C)''' || 60
| colspan="2" | 150
| colspan="2" | 60
| 150
|-
| '''O<sub>2</sub> flow (sccm)''' || 10050
| colspan="2" | 80
| colspan="2" | 35
| 80
|-
| '''NF<sub>3</sub> flow (sccm)''' || 0| colspan="2" | 0| colspan="2" | 0| 8|-| '''Power (W)''' || 1000800
| colspan="2" | 800
| colspan="2" | 100
| 800
|-
| '''Etch rate (Å/min)''' || N/A
| colspan="2" | 5000
| colspan="2" | 600
|
|-
| '''Uniformity (%)''' || N/A
| colspan="2" | 1.5
| colspan="2" | 20
|
|}
Custom Use of custom recipes may be created and saved in slots 7-12requires additional training. For instructions on how to use the recipe editor, please follow the guide in section F of the SOP (below). For some guidelines on recipe development, please review Please see the [https://docs.google.com/document/d/1DZ8SI3aaDfWiGep59aFnqrxW6jufzdZ9JXu8U5ckWW4/preview standard processes[{{PAGENAME}}#Super_user_checkout_procedure | checkout procedure]] documentbelow. Custom recipes may be documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system. ==Standard operating procedure=='''[https://drive.google.com/file/d/10HJbxRzMlYwAw6onGxglvg99YJ9GDhmE/view?usp=sharing PDF Copy]''' {{#widget:GoogleDoc|key=1BIA91s15C-1ja4j1KIjTy3KRzyjeq0Fjywk2CdsCTtA}}
==Standard Operating ProcedureCheckout procedure==<!-- To include a document from google docs, use the line below, replace "googledocid" Follow this procedure to receive authorization to run supported processes. Practicing with the ID for the documentan authorized user or staff member is strongly recommended but not required. Remember, to make # Read this visible, you must set Sharing for page and the [https://docs.google.com/document to "Anyone with /d/1BIA91s15C-1ja4j1KIjTy3KRzyjeq0Fjywk2CdsCTtA/preview user manual].# Accurately complete the link can view"[https://docs.google. com/forms/d/e/1FAIpQLScO2ww44I-yWO5of79tBhYEdsKA3t-KqhlBq1bg->5sgMtpaVQ/viewform?usp=sf_link checkout quiz] (you may retake if necessary).{{#widget:GoogleDoc|key=19PctJdqREy4frN86fx64_3rUvEWrNNYzJGmFwif_978}}Create a helpdesk ticket requesting authorization.# Given successful completion of the quiz, a tool engineer will authorize you on the tool.
==Checkout Procedure=Super user checkout procedure===The following steps should be taken to gain access to the tool:# Read through this page and the Standard Operating Procedure above.# Practice on the tool with a qualified user# Complete the checkout quiz found [https://docs.google.com/aforms/d/lnf.umich.edue/spreadsheet1FAIpQLSfgiDv7_WOe_a0F3FPPf2QtZTn2xNUAJlCful_o15C5T1WJlw/viewform?formkeyusp=dEg0Slk3LVhfWlVLZW9oYXo4ZnNISVE6MQ#gid=0 heresf_link process request form]# Create and create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Tickethelpdesk ticket] requesting checkout. If this checkout is # Review the procedure provided in the ticket response.# Accurately complete the quiz provided in the ticket response.# Arrange a training session with a tool engineer via the ticket.# Given successfulcompletion of the quiz and demonstration of proper tool operation, the a tool engineer will authorize you on provide the access code. Do not share the toolaccess code.
==Maintenance==
* A leak check and plasma clean is performed monthly* The chamber is disassembled and cleaned once per quarter and process condition is verified.twice a year
===User Authorized Maintenanceauthorized maintenance===
The only maintenance that users are authorized to perform is tool startup in the event of a power bump. Please see the [https://docs.google.com/document/d/13gVIzr2tf87rtDnioNH-qU8P1Vk_1km3w7d9oy-PnRA/preview Startup and Shutdown Procedure] for more details.
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