Jump to navigation Jump to search


72 bytes added, 2 years ago
no edit summary
|manufacturer = [ Yield Engineering Systems]
|model = CV200RFS(E) }}
The [[{{PAGENAME}}]] (referred to as the '''YES Plasma Stripper''' on the [[LNF Scheduler]]) is a single wafer, downstream [[Plasma etching#Plasma_ashing|plasma strip/descum]] tool designed by [ Yield Engineering Systems]. It is designed for fast plasma stripping of [[photoresist]]s and other organic materials at up to 7000 Å/min. It can also be used for [[surface modification]] and gentle surface cleaning. It supports pieces and wafers from 2” to 8” and wafer pieces. The tool mainly uses [[oxygen]] plasma for organics removal, but it has been configured with three additional process gases ([[Ar]], [[Nitrogen|N<sub>2</sub>]], and [[Nitrogen trifluoride|NF<sub>3</sub>]]), for additional stripping and surface modification techniques.
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Bureaucrats, Interface administrators, Administrators, Widget editors


Navigation menu