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STS Pegasus 4/Processes

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<!-- This should be created as a sub-page of a tool and list the processes available on the tool, which can then be detailed in individual process sub-pages -->
{{#vardefine:technology|DRIE}}
This page lists the processes supported by the LNF for the [[{{BASEPAGENAME}}]]. The same recipes are available on the [[STS Pegasus 6]], although due to hardware differences, the etch rates and uniformity will be slightly different.
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The primary recipes for the STS Pegasus 4 are used for deep silicon etching. Recipe 1 is optimized for clean sidewalls, while Recipe 2 and 3 allow for faster etches. The tool has an oxynitride etch that may be used to etch oxide or nitride but this may be performed by other tools more effectively, such as the [[P5000 RIE]]. There is also a LNF Thinning recipe designed to quickly etch a wafer without a mask.
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