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|mask = not typical
|chemicals =
|gases = [[Sulfur hexafluoride|SF<sub>6</sub>]], [[Oxygen|O<sub>2</sub>]]
|created =
|modified =
|authors =
}}
'''{{SUBPAGENAME}} ''' (previously known as '''LNF Si Thinning''') is an SF<sub>6</sub> based process intended for isotropic thinning of Si wafers for device release. It does not have high uniformity, but has good selectivity to other materials.
==Procedure==
|-
| Silicon nitride
| ?150 Å/min | ?11%|-| Low stress nitride| 120 Å/min | 10%
|-
| SPR 220
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