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Endeavor M1 AlN Sputter Tool

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===Hardware Details===
*Turbo-pumped/Water-pumped (high temp cryo that acts as a water trap,) loadlocked sputtering tool. Base pressures in the 10-7, 10-8 range
*10 KW AC power supply that runs 5-7KW power across a dual Al target source
*RF bias on wafer holding platen to control surface characteristics.thru Ar and N2 bombardment*Backside lamp heating*100 50 sccm N<sub>2</sub> and 20sccm Ar and 20sccm O2 flow meters.
*Handler for 6" wafers, carrier for 4" wafers.
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser
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