*Turbo-pumped/Water-pumped (high temp cryo that acts as a water trap,) loadlocked sputtering tool.
*10 KW AC power supply that runs 5-7KW power across a dual Al target source
*RF bias on wafer holding platen to control surface characteristics
.* 100 sccm N<sub>2</sub> and Ar flow meters.
*Handler for 6" wafers, carrier for 4" wafers.