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Wire bonding

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The MPP iBond 5000 Wedge Bonder is designed to connect bond pads on a device to the leads of a package such as DIP or TO-5 cases. It can also be used to interconnect bond pads between two devices, the same device, or to a printed circuit board. The Wedge Bonder offers control of individual bond parameters and programmable loop formation.
[[MPP iBond5000 iBond 5000 Ball Bonder]]
The MPP iBond 5000 Ball Bonder designed to connect bond pads on a device to the leads of a package such as DIP or TO-5 cases. It can also be used to interconnect bond pads between two devices, the same device, or to a printed circuit board. Single point TAB, ball bumping, and coining, together with standard ball bonding, offer process flexibility and versatile capabilities. TAB and coining require a special tool.
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