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STS Pegasus 4/Processes/LNF Recipe 2

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|modified =
|authors = SPTS, Brian Vanderelzen, Kevin Owen
}} '''{{SUBPAGENAME}}''' is designed for deep and through wafer etching of small (1-500 μm) features on masks with a low exposed area (<20%). Undercut and scalloping is larger than LNF Recipe 1, but etch rates are higher (4-13 μm/min).
==Procedure==
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