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STS APS DGRIE

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The primary recipes for the STS Glass Etcher are used for deep oxide/quartz/silica etching. The [[/Processes/uk submicron etch|uk submicron etch]] is designed for thin-film (up to 8 μm) etching of oxide. Feature sizes can range from 100 nm to a full wafer. The [[/Processes/Fused silica etch|Fused silica etch]] is designed for deep etching of fused silica, quartz, and glass. More details on the supported processes can be found on the [[/Processes/]] page.
<!-- REVIEW THIS PARAGRAPH!!!!!In addition to the supported recipes, there are recipes available (largely uncharacterized) for a wide variety of materials, including [[Metals#Non-reactive|non-reactive metals]], [[PZT]], and [[Silicon carbide]]. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you have a requirement outside those covered by, or are not getting satisfactory results from the standard recipes we strongly advise you to make [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdesk ticket] to consult a tool engineer on what steps to take to improve your etch results.-->
==Standard operating procedure==
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Bureaucrats, Interface administrators, Administrators, Widget editors
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