-->'''{{SUBPAGENAME}}''' (previously known as LNF ASH) uses an O<sub>2</sub> plasma to isotropically remove polymers. It is intended as a photoresist descum prior to etching, although it may oxidize expose surfaces. The [[../LNF Ar Descum/]] is better suited for normal circumstances. This recipe may also be used for photoresist mask stripping post process, although there are other systems at the LNF with better performance for this process.