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{{main|{{BASEPAGENAME}}/Processes}}
The primary recipes for the STS Pegasus 4 are Bosch style recipes used for deep silicon etching. There are four main Bosch process recipes with varying properties. The tool also has an oxynitride etch that may be used to etch a mask layer prior to the Si etchtwo slow, but this may be performed isotropic recipes designed for thinning wafers by other tools more effectively. There is also a thinning recipe designed to quickly etch small amount, typically for process release, and a wafer without a maskfew "support" recipes. More details Details on supported processes can be found on the [[/Processes/]] page.
In addition to these, this tool has a number of user-created recipes for specific processes. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} User Processes]]. For more information, please contact the tool engineers via the helpdesk ticket system.
{{note|For all process questions, fill out the [https://docs.google.com/forms/d/e/1FAIpQLSf4FcYP1XIoE-scXpXtmaegIzceSVe3uaR8e9P3K3LQAvn20w/viewform process request form] and create a helpdesk ticket.|reminder}}
==Standard operating procedure==
