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Plasmatherm 790/Processes/m pary1

59 bytes removed, 1 year ago
*[[Parylene]] Etch Rate: 2000 Å/min
* [[SPR 220]]: 2000 Å/min
* [[PDMS]]: ? Å/min
===Mask Selectivity===
* [[Silicon|Si]] Etch Rate: <5 Å/min
* [[Silicon Dioxide|SiO2]] Etch Rate: <5 Å/min
 
===Sidewall Profile===
* Undercut: ?
==Limitations==
The limitations for this recipe are still being defined.
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