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AZ 12XT

6 bytes removed, 1 year ago
*Develop on the CEE Develop stations using 726 DP 60-60
*Hard Bake
**For wet etching or platting Wet processing: hard bake at 110°C for 1 minute
*Removal
**For thickness <17um spins removal as normal. (ash, PRS-2000, and/or nanostrip)
**For thickness >17um
***PRS-2000 at 60°C for 10-15 minutes, or
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser
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