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*Removal
**For thickness <17um spins removal as normal. (ash, PRS-2000 and/or nanostrip)
**For thickness >17um
***PRS-2000 at 60°C for 10-15 minutes, or
***Ash at temp lower than 100°C to break through RIE hardened layer
***PRS-2000 after ash to remove most of PR
*Hard Bake
**Wet processing: hard bake at 110°C for 1 minute
==Characterization==
