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LAM 9400/Processes/LNF Poly

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[[Category:Processes]] [[Category:RIE]]
LNF_Poly is designed for etching [[Silicon|Si]] and [[Polysilicon]] in the LAM 9400. This recipe produces a very vertical sidewall angle and has a high selectively to oxide (~18:1). This process requires a large amount of exposed silicon in order to stabilize, so a Si carrier wafer is required.
==Etch Rates==
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