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AZ 12XT

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*Hard Bake
**Wet processing: hard bake at 110°C for 1 minute
*Removal
**If wafers have been through a plasma you MUST start with a Oxygen ash to remove most the pr. You can follow with PRS-2000 or nanostrip
**If wafer have been through any other process you can use Oxygen plasma, PRS-2000, or nanostrip.
==Characterization==
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser
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