|equipment = [[:Category:RIE equipment|List of RIE equipment]]
Reactive ion etching (RIE) is a high resolution mechanism for [[etching]] materials using [[Plasma etching|reactive gas discharges]]. It is a highly controllable process that can process a wide variety of materials, including [[semiconductors]], [[dielectrics]] and some [[Reactive metals|metals]]. One major advantage to RIE over other forms of etching is that the process can be designed to be highly [[Isotropy|anisotropic]], allowing for much finer resolution and higher aspect ratios. For a detailed overview of RIE, please review the [https://
docs.google.com /a/lnf.umich.edu/file/d/0B76AgohVTgqdamFiaE1mRk9mVmM/ preview technology workshop].