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Plasmatherm 790/Processes/L ox200

2 bytes removed, 11 months ago
|-
| Deposition Rate
| 7.5 Å48 nm/secmin
|-
| Index of Refraction
| 1.466469
|-
| Stress
| -325 350 MPa
|-
|}
This process is qualified with a 5 min run. The max allowed thickness is 2µm.
 
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