OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Bureaucrats, Interface administrators, Administrators, Widget editors
2,155
edits
Changes
Jump to navigation
Jump to search
no edit summary
This recipe is designed to etch HfO<sub>2</sub>. Since Hf byproducts may not be effectively removed by the standard waferless autoclean we require a post etch process to be run to generate SiCl<sub>4</sub> which is effective at cleaning Hf. The recipe "Wafer_Clean_SiCl4" needs to be run on a blank Si wafer for 5 min after etching HfO2 in this process.
==Procedure==
# Run etch
# Run Wafer_Clean_SiCl4 for 5 min on a blank Si wafer
==Etch RatesCharacterization==
These were measured using pieces mounted to a 6" Si carrier.
