|size = 150mm x 4mm and smaller samples
|gases = [[Ar]], [[N2|N
|overview = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1UZYJ8unAjQOIJ3nJpa1fwXxYKMyW12k6eDR-A-P6fIE/preview System Overview]-->
|sop = <!--[https://docs.google.com/a/lnf.umich.edu/document/d/1EPC0U7RQCQLbFe4fL90aMUlLz-fydskqWrUs4hVPpbM/preview SOP]-->
|processes = [[
<!-- Insert the tool description here -->
Lab 18-2 is a
magnetron [[sputter deposition]] tool for '''depositing''' '''common and precious metals. ''' Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. Electrically conductive material such as Al, W, and Ti can use a dc power source, in which the target acts as the cathode in a diode system. Sputtering of dielectrics such as silicon dioxide, or aluminum oxide requires an Rf power source to supply energy to the argon atoms. Sputter films are ideal for sidewall coverage in low thermal budget cases for contact and insulating layers over features.
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The target configuration has been moved to the Supported Process section below . Follow the link to Lab 18- 2/ Processes. On that page under the Target Calendar header is the link to the calendar. [https://docs.google.com/ a/ lnf.umich.edu/ spreadsheet/ ccc?key=0AsWeTTMTotIfdGxLMlpVZm1NSlF0SDJMU3hvRFctR1E#gid= 13| Lab 18-2 Target Change Calendar]
* Computer controlled recipes
* Load lock supported processing
limited film stress versatility with in film development .* Reactive Film capabilities (Ar , O<sub>2</sub>, and N<sub>2</sub>)
=== Tool Manual ===
Includes an introduction to the tool and reservation information.
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