The CL200 Megasonic Cleaner is a [[Cleaning|substrate cleaner]] that can process 100 mm or 150 mm wafers. It uses either DI or an [[RCA clean]] with a megasonic action to clean the wafers. The tool then dries the wafers via spinning with IR heating. Wafers should be cleaned in this tool before going into a bonder such as the [[EVG 520IS]] or [[SB-6E Bonder]] to reduce particulate.
* [2014-07-01] [[JTB 100 Wafer Clean]] added to tool.