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|maintenance = [https://docs.google.com/a/lnf.umich.edu/document/d/1OvMzJ2QibI7rEU3ApebmoEPh_nvhBoVxd8NIxHiax0U/preview Maintenance Overview]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:Plasmatherm_790_User_Processes|User Processes]] }} {{warning|This page has not been released yet.}} The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for reactive ion etching (RIE) while the right chamber is configured for plasma enhanced chemical vapor deposition (PECVD). The RIE chamber is one of the slower etchers in the lab, especially compared to the [[P5000_RIE]]. The main advantage is that there are almost no material restrictions, so a wide variety of materials can be processed. The PECVD is also much slower compared to the [[P5000_PECVD]]; this can actually be advantageous as the smaller building blocks can improve a films quality.
