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Plasmatherm 790

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{{lead too short}}{{#vardefine:toolid|10030}} {{#vardefine:technology|RIE}} {{resource}} {{#vardefine:restriction|3}} [[Category:PECVDPECVD_equipment]] {{infobox equipment
|restriction = [[{{PAGENAME}}#Material_Restrictions|Metals]]
|materials = [[Si]], [[SiO2|SiO<sub>2</sub>]]
|mask = [[Photoresist|PR]], [[SiO2|SiO<sub>2</sub>]]
|gases = [[Argon|Ar]], [[Methane|CH<sub>4</sub>]], [[Fluoroform|CHF<sub>3</sub>]], [[Tetrafluoromethane|CF<sub>4</sub>]],
[[HeH2|HeH<sub>2</sub>]], [[Oxygen|O<sub>2</sub>]], [[SF6|SF<sub>6</sub>]]
|overview = [[{{PAGENAME}}#System_Overview | System Overview]]
|sop = [https://docs.google.com/a/lnf.umich.edu/document/d/1iRHIBHG0BvqpsX1quhb8YszCImOkyvzJx_SxqluPOt8/preview [{{PAGENAME}}#Standard_Operating_Procedure | SOP]|maintenance = [https://docs.google.com/a/lnf.umich.edu/document/d/1OvMzJ2QibI7rEU3ApebmoEPh_nvhBoVxd8NIxHiax0U/preview Maintenance Overview]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:Plasmatherm_790_User_Processes|User Processes]] }} {{warning|This page has not been released yet.}} The Plasmatherm 790 is a dual chamber parallel plate tool. The left chamber is configured for [[Reactive ion etching|reactive ion etching (RIE) ]] while the right chamber is configured for [[PECVD|plasma enhanced chemical vapor deposition (PECVD)]]. The RIE chamber is one of the significantly slower than other etchers available in the lab, especially compared to the [[P5000 RIE]]. The main advantage is that there are almost no material restrictions, so a wide variety of materials can be processedallowing greater depth control on thin films. The PECVD chamber is also much slower compared designed to deposit at a lower rate than the [[GSI PECVD]] and [[P5000 PECVD]]; this can actually be advantageous as - the smaller building blocks can help improve film quality. This tool has almost no material restrictions, allowing a films qualitywide variety of processing.
==Announcements==
*[2014-09-25] - Added 500 sccm Helium MFC to PECVD chamber.
==Capabilities==
* Wide variety of gases available
* Generally slower etch rates <1000 Å/min
* Generally slow PECVD deposition rates <10 Å/sec
==System Overview==
* RIE Gases
** [[Argon|Ar]] - 139 sccm
** [[Methane|CH<sub>4</sub>]] - 18 14 sccm
** [[Fluoroform|CHF<sub>3</sub>]] - 50 sccm
** [[Tetrafluoromethane|CF<sub>4</sub>]] - 42 sccm
** [[HeliumHydrogen|HeH<sub>2</sub>]] - 101 sccm
** [[Oxygen|O<sub>2</sub>]] - 100 sccm
** [[Sulfur Hexafluoridehexafluoride|SF<sub>6</sub>]] - 52 sccm
* PECVD Gases
** [[Methane|CH<sub>4</sub>]] - 72 sccm
** [[Tetrafluoromethane|CF<sub>4</sub>- 4% O<sub>2</sub>]] - 420 sccm
** [[Helium|He]] - 500 sccm
** [[Nitrogen|N<sub>2</sub>]] - 2000 sccm
** [[Nitrous Oxideoxide|N<sub>2</sub>O]] - 497 sccm
** [[Ammonia|NH<sub>3</sub>]] - 3 sccm
** [[Silane|SiH<sub>4</sub>]] - 6 sccm
* Pressure
** RIE: 5 - 300 mTorr1 Torr Guage** PECVD: 50 - 2000 mTorr2 Torr Gauge
* Chuck
====Left Chamber====
{{#widget:ApprovedMaterials|toolid={{#var:toolid}}1|header=N}}
 
====Right Chamber====
The right chamber has the same restrictions as the left except polymers (such as photoresist) are not allowed unless their melting temperature is significantly higher than the process temperature (please create a helpdesk ticket for this).
==Supported Processes==
{{expand section|the process subpages are incomplete}}
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.
 
The latest PECVD qualification data is shown below.
 
{{#widget:Iframe
|url=https://docs.google.com/spreadsheets/d/1jDSV00jZ-1vppt2MgGRAJyXRvxEE3rJIlXtngODM9-0/pubhtml?gid=1394489689&amp;single=true&amp;widget=true&amp;headers=false
|width=650
|height=260
|border=1
}}
==Standard Operating Procedure==
<!-- To include a document from * [https://drive.google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view"com/open?id=1ISeylrCbnE2g8E1acoAKEbNmKXi6CH2f System Overview]* [https://drive.google. com/file/d/0B3k-qgz56T_4RVJqUHp3eEsySUk/view?usp=sharing&resourcekey=0->ClQBXI80fBwIL1FR48tt7w RIE SOP]{{#widget* [https:GoogleDoc|key//drive.google.com/open?id=1iRHIBHG0BvqpsX1quhb8YszCImOkyvzJx_SxqluPOt8}}1iWQMtPGj8M9KQmTBJgTBk6jxuMiWCSk4 PECVD SOP]* [https://drive.google.com/open?id=1QiY9Xwt1ucw9axn4JTanLy-OA4QeXEIU Troubleshooting]
==Checkout Procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through the Standard Operating Procedure User Manual above.# Complete Accurately complete the training request form [https://docs.google.com/a/lnf.umich.edu/forms/d/16kHlwOrAQk_nybzzXjYk78_aENmJiy33jJ7gj18lJKge/1FAIpQLSff-AcfmVpwlCTYKOQVe_sV0Rz_IE_B4vn0Pml7HX3eHcOC2w/viewform SOP quiz]. You may retake as necessary until all answers are correct.# For RIE, complete the [https://docs.google.com/forms/d/e/1FAIpQLSf4FcYP1XIoE-scXpXtmaegIzceSVe3uaR8e9P3K3LQAvn20w/viewform hereprocess request form].# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} helpdeskticket] ticket requesting traininga checkout session.# A tool engineer Authorization will schedule a time for initial training.# Practice with your mentor or another authorized user until you are comfortable with tool operation.# Complete be provided pending successful completion of the SOP quiz [https://docs.google.com/a/lnf.umich.edu/forms/d/1CBvtjKtkjMqKE0OP6Gm2dIBxlyF-DDZvQTfM4zEgDZc/viewform here].# Schedule a checkout session with a and demonstration of proper tool engineer via the helpdesk ticket system. If this checkout is successful, use in the engineer will authorize you on the tool. ==Maintenance== Every other week presence of a light cleaning is performed on the toolengineer. A 5 min etch with m_si_o_1 is performed on a 4" oxide wafer as a qualification run. The results can be seen below. {{#widget:Iframe|url=https://docs.google.com/spreadsheets/d/1jDSV00jZ-1vppt2MgGRAJyXRvxEE3rJIlXtngODM9-0/pubchart?oid=947675517&amp;format=interactive |width=700|height=350|border=0}}
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