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Sputter deposition

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|image = [[File:Sputter Deposition.png|center|300px]]
|caption =
|materials = [[Silver|Ag]], [[Aluminum|Al]], [[Aluminum oxide|Al2O3]], [[Gold|Au]], [[Chromium|Cr]], [[Copper|Cu]], [[Iron|Fe]], [[Germanium|Ge]], [[Indium|In]], [[Nickel|Ni]], [[Nichrome|NiCr]], [[Platinum|Pt]], [[Silicon dioxide|SiO2]], [[Silicon monoxide|SiO]], [[Titanium|Ti]], [[Titanium dioxide|TiO2]], [[Zinc|Zn]], [[Zinc selenide|ZnSe]]
|mask =
|size = 6", 4", 3" and 2" wafers, pieces
|chemicals =
|gases = Ar, N2, O2 1%, O2 0.1%
|overview = [[Wikipedia:Sputter_deposition|General Overview: Wikipedia Sputter Deposition]]
|sop =
<!--[[File:Electron_Beam_Evaporation.jpg|right|300px]]-->
[[Wikipedia:Electron_beam_physical_vapor_depositionSputter_deposition|Electron Beam EvaporationSputter Deposition]] is a form of physical vapor deposition in which (PVD) method of thin film deposition by sputtering. This involves ejecting material from a "target anode " that is bombarded with an electron beam given off by a tungsten filament under high vacuumsource onto a "substrate" such as a silicon wafer. The accelerated electrons strike the target and melt/sublimate Resputtering is re-emission of the deposited material to transform into during the gaseous phasedeposition process by ion or atom bombardment. These Sputtered atoms then precipitate into solid formejected from the target have a wide energy distribution, typically up to tens of eV (100, coating everything 000 K). The sputtered ions (typically only a small fraction of the ejected particles are ionized — on the order of 1%) can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber (within line of sightcausing resputtering) with a thin layer of the anode material.
==LNF Capabilities==
<!--A more general description of what the tool is capable of doing.-->
*The LNF has 4 E-Beam EvaporatorsSputter Deposition Tools** [[Enerjet EvaporatorLab 18-1|Enerjet EvaporatorLab 18-1]]** [[Cooke EvaporatorLab 18-2|Cooke EvaporatorLab 18-2]]** [[SJ-20 EvaporatorTegal ALN Sputter|SJ-20 EvaporatorTegal ALN Sputter]]** [[SJDenton Explorer-26 Evaporator14|SJDenton Explorer-26 Evaporator14]]
**[[Gold|Gold (Au)]]
**[[Germanium|Germanium(Ge)]]
**[[Indium|Indium(In)]]
**[[Iron|Iron(Fe)]]
**[[Magnesium flouride|Magnesium flouride (MgF)]]
**[[Nickel|Nickel (Ni)]]
**[[Nichrome|Nichrome (NiCr)]]
**[[Palladium|Palladium(Pd)]]
**[[Platinum|Platinum(Pt)]]
**[[Silicon dioxide|Silicon dioxide(SiO2)]]
**[[Silicon monoxidenitride|Silicon monoxidenitride(SiOSiN)]]
**[[Silver|Silver(Ag)]]
**[[Tin|Tin(Sn)]]
**[[Titanium|Titanium(Ti)]]
**[[Titanium dioxide|Titanium dioxide(TiO2)]]
**[[Zinc|Zinc(Zn)]]
**[[Zinc selenide|Zinc selenide(ZnSe)]]
==References==
*[[Wikipedia:Sputter_deposition|General Overview: Wikipedia Sputter Deposition]]
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