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MA-BA-6 Mask-Bond Aligner

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|materials = [[Photoresist]]
|mask =4", 5", 7" mask plates
|size = 4" and 6" wafers. Pieces with staff approval
|chemicals = LNF approved photoresists
|gases =|overview = [[{{PAGENAME}}#System_Overview | System Overview]]|sop = [ SOP]|processes view?usp= [[{{PAGENAME}}/Processes|Supported Processes]]|maintenance sharing&resourcekey= [[{{PAGENAME}}#Maintenance | Maintenance]0-zjzn27ZsmH7-CnhV664jCw Topside Mask Alignment SOP]
{{warning|This page has not been released yet.}} This tool is primarily used to expose [[Photoresist|photo-definable]] materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. This tool is capable of backside alignment. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the [[SB-6E Bonder]].
<!--A more general description of what the tool is capable of doing.-->
* 1-2 µm min feature size resolution in thin resist
* Aspect Ratio 1:3 fairly standard
* Substrate thickness 200 µm to 4 mm possible
* Capable of back side alignment
==System Overviewoverview=={{#widget:GoogleDoc|key=1lv9Fn5spwDrptJDpjkIkggPPx6GujKKS-S9dmdsItRw}}
===Hardware Details===
* Broadband light source calibrated to 20mJ20 mJ/sec at the 405nm 405 nm peak. Total broadband dose about 30mJ~30 mJ/sec
* 4" and 6" chucks
** Backside alignment piece chuck available with staff permission.
* 4", 5" and 7" mask holders
* Flood exposure, soft, hard, and vacuum contact capable (for details, see SOP)
* Capable of topside, backside and wafer to wafer alignment
* 10mm 10 mm stage travel, 150mm 150 mm microscope objective travel with split field view camera option
===Substrate Requirementsrequirements===* Full 4" and 6" wafers standard** Pieces possible (pieces should use the [[MJB3-2|MJB3]] with tool engineer approvala 4" mask)
* Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance
* Substrate thickness 200 µm to 4 mm possible
===Material Restrictionsrestrictions==={{material restrictions}}Allowed Materials - LNF approved photoresists Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)
==Supported Processesprocesses== This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave 5% uniformity across the link below4” area. Alternatively, you may include the information on The 365 peak output is about half of this pageand tracks very well however is not routinely calibrated. In that case We allow 4” masks, 5” masks, the Supported Processes document from the equipment manual can be included here7” masks, transparencies, shadow masking, using {{#widget:GoogleDoc|key=googledocid}} -->or a manually timed flood exposure.
Exposure of all LNF approved photoresists are allowed on this tool in accordance with standard operating procedure. More , for data on photoresist exposure times can be found on the supported processes specific resist please see that resists wiki page [[MA-BA-6_Mask-Bond_Aligner/Processes]].Data sheets for specific Photoresists can be found , such as [[hereSPR 955]].
==Standard Operating Procedureoperating procedure==<!* [ To include a document from 0fSam_yon_Y7uCxykeXDpA System Overview]* [ docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can com/file/d/0B3k-qgz56T_4a0JrTjR5N004d2s/view". ?usp=sharing&resourcekey=0-zjzn27ZsmH7->CnhV664jCw Topside Mask Alignment SOP]{{Cleanup* [|sectionqgz56T_4c1k4dEhvdlZfcnc/view?usp=sharing&resourcekey=0-pJyidlm-pXqJBdOoreSFMw Backside Mask Alignment SOP}}]{{#widget* For Bond Alignment please make a Helpdesk ticket* [https:GoogleDoc|key//}}5nKwkOokCWra5e4sv6w50g Troubleshooting]
==Checkout Procedure==<!-- Describe the checkout procedure for the tool. For example: --># Read through this page and the Standard Operating Procedure above.# Create a [{{#var:toolid}} Helpdesk Ticket] requesting training.# A tool engineer will schedule a time for initial training.# Practice with your mentor or another authorized user until you are comfortable with tool operation.# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
==Maintenance== # Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again.# Practice on the tool with your mentor.# Read through the User Manual above.# Accurately complete the [ checkout quiz]. You may retake as necessary until all answers are correct.# Schedule a time for a checkout:<!## Find an available time for checkout [ Describe standard maintenancealigner-checkout here].## Verify that the tool is available in the [ tests here ResourceDayWeek.aspx?Path=0-0-0->{{expand section|lamp dosage, maybe WEC rebuilds#var:toolid}}LNF Online Services] at the time you are requesting.The UV energy at ## After confirmation that the chuck face event is routinely calibratedscheduled in Calendly, so that invite the energy delivered corresponds staff member assigned to the display on the lamp controlleryour event to a Staff Support reservation at that time. The energy delivered is 20 mJ# Create a [http://sec at the 405nm wavelength with an additional 9ssel-10 at the 365nm wavelength (the 365nm peak is not calibrated, but is constant in relation to the 405nm peak)ResourceContact. Lamp uniformity is routinely calibrated to within 2-aspx?tabindex=3 % across the 150 mm range&path=0:0:0:{{#var:toolid}} helpdesk ticket] for final confirmation of your checkout appointment.The WEC (Wedge Error Compensation) head is completely rebuilt semi annually and checked monthly and adjusted as needed for level# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
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