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MA6 Mask Aligner

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--> {{#vardefine:technology|Contact Lithography}} <!--
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals
--> {{#vardefine:restriction|32}}
{{infobox equipment
|caption =
|materials = [[Photoresist]]|mask =4", 5", 7" mask plates|size =4" and 6" wafers|chemicals =|gases = LNF approved photoresists|overview = [[{{PAGENAME}}#System_overview | System Overview]]|sop = [ SOP]|processes file/d/0B3k-qgz56T_4WXo4VFVnWjI4R0k/view?usp= [[{{PAGENAME}}/Processes|Supported Processes]]|userprocesses sharing&resourcekey= [[LNF_User:{{PAGENAME}}_user_processes|User Processes]0-A8jY9b2Rzqq1OYCmiI7r_w Topside Mask Alignment SOP]|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 The [[{{warning|This page has not been released yet.PAGENAME}} <!]] is primarily used to expose [[Photoresist|photo-- Insert the tool description here --> ==Announcements==*Update this with announcements as necessarydefinable]] materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure.
<!--A more general description of what the tool is capable of doing.-->
* Etch Rate* Resolution2 µm min feature size resolution in thin resist* Aspect Ratio1:3 fairly standard* Thickness rangeSubstrate thickness 200 µm to 4 mm possible
==System overview==
===Hardware detailsDetails===* GasesBroadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose about 30 mJ/sec* Pressure4" and 6" chucks* Chuck4", 5" and 7" mask holders* ChamberFlood exposure, soft, hard, and vacuum contact capable* RF / Power SpecsTopside alignment (no backside or bond alignment)* Chemicals10 mm stage travel, 150 mm microscope objective travel with split field view camera option
===Substrate requirements===
* Wafer SizeFull 4" and 6" wafers standard * Wafer typePieces are not allowed in this mask aligner. For pieces use MJB3 instead* Any mounting?Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance* Wafer Substrate thickness200 µm to 4 mm possible
===Material restrictions===
{{material restrictions}}Allowed Materials - LNF approved photoresists Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)
==Supported processes==
This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave 5% uniformity across the link below4” area. Alternatively, you may include the information on The 365 peak output is about half of this pageand tracks very well however is not routinely calibrated. In that case We allow 4” masks, 5” masks, 7” masks, the Supported Processes document from the equipment manual can be included heretransparencies, using {{#widget:GoogleDoc|key=googledocid}} --> There are several processes for this tool supported by the LNFshadow masking, which are described in more detail on the [[/Processes/]] pageor a manually timed flood exposure.
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->In addition to these, this tool has a number Exposure of user-created recipes for etching a wide variety of materials. Some of these recipes all LNF approved photoresists are documented allowed on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you are curious if your material can be processed in this tool, for data on specific resist please contact the tool engineers via the helpdesk ticket systemsee that resists wiki page.
==Standard operating procedure==
<!* [ To include a document from 54OMu8wX_SgVg3lwk8zSmQ System Overview ]* [ docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can com/file/d/0B3k-qgz56T_4WXo4VFVnWjI4R0k/view". -?usp=sharing&resourcekey=0->A8jY9b2Rzqq1OYCmiI7r_w Topside Mask Alignment SOP]{{#widget* [https:GoogleDoc|key//}}sharing&resourcekey=0-hq5tzpfZ3eoziMnhobUb2w Troubleshooting]
==Checkout procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through this page and the Standard Operating Procedure above.
# Complete the training request form [ here].
# Create a [{{#var:toolid}} Helpdesk Ticket] requesting training.
# A tool engineer will schedule a time for initial training.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
# Complete the SOP quiz [ here].
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
<!-- Describe standard maintenance/qualification tests here -->
===Process name===<!-- This is an example # Complete a chart published with etch data[[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again. You can just replace # Practice on the url tool with your ownmentor. # Read through the User Manual above.# Accurately complete the [ checkout quiz]. You may retake as necessary until all answers are correct.# Schedule a time for a checkout:## Find an available time for checkout [>aligner-checkout here].## Verify that the tool is available in the [{{#widgetvar:Iframetoolid}} LNF Online Services] at the time you are requesting.|url=chart url## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.|width# Create a [|height=400|border3&path=0:0:0:{{#var:toolid}}helpdesk ticket] for final confirmation of your checkout appointment.# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Bureaucrats, Interface administrators, Administrators, Widget editors


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