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Reactive ion etching

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===Dielectric etching===
not sure if I like where thisis going...
==Equipment==
Below is a general description of the RIE equipment at the LNF. For a complete list, please see [[:Category:RIE equipment|list of RIE equipment]].
 
===LAM 9400 SE===
{{main|LAM 9400 SE}}
 
The LAM 9400 SE is an [[ICP]] etcher configured with a wide range of gas chemistries. It is mainly used to etch [[polysilicon]] but can also etch [[silicon dioxide|SiO<sub>2</sub>]], [[silicon nitride|Si<sub>3</sub>N<sub>4</sub>]], [[compound semiconductors]], some [[Reactive metals|metals]], and [[polymers|organic]] materials.
 
===Plasmatherm 790===
{{main|Plasmatherm 790}}
==See also==
<internal links>* [[Plasma etching]]* [[Plasma processing]]
==Notes==
==References==
<footnotescitations>
==Further reading==
* [https://docs.google.com/a/lnf.umich.edu/file/d/0B76AgohVTgqdamFiaE1mRk9mVmM/preview RIE Workshop January 16th, 2015]
[[Category:RIE|RIE]]
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