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Plasma etching

523 bytes added, 7 years ago
Chamber pressure varies depending on the system and material being etched but typically ranges from 5 mTorr to 300 mTorr. Typically, more physical etches and etches designed to be very vertical or to have high aspect ratios run at lower pressures, while more reactive etches will use a higher pressure to increase the density of the reactive gases. Most plasma etching systems control the pressure in the chamber using a throttle valve on the exhaust port, allowing it to be accurately set regardless of the gases chosen.
===Plasma source and power===
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