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MA6 Mask Aligner

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--> {{#vardefine:technology|Contact Lithography}} <!--
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals
--> {{#vardefine:restriction|32}}
{{infobox equipment
|caption =
|materials = [[Photoresist]]
|mask =4", 5", 7" mask plates
|size = 4" and 6" wafers. Pieces with staff approval
|chemicals = LNF approved photoresists
|gases =|overview = [[{{PAGENAME}}#System_Overview | https://drive.google.com/file/d/0B3k-qgz56T_4YWJLc2t3ZUJQZ2s/view?usp=sharing&resourcekey=0-54OMu8wX_SgVg3lwk8zSmQ System Overview]]|sop = [https://docsdrive.google.com/a/lnf.umich.edu/documentfile/d/1fqWwTY2zI1o1NFhlDWI0ZVJ0lsMnCfwpj1QXhZApKyc0B3k-qgz56T_4WXo4VFVnWjI4R0k/preview view?usp=sharing&resourcekey=0-A8jY9b2Rzqq1OYCmiI7r_w Topside Mask Alignment SOP]|processes = [[{{PAGENAME}}/Processes|Supported Processes]]|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
}}
 This tool The [[{{PAGENAME}}]] is primarily used to expose [[Photoresist|photo-definable]] materials. We allow 4” masks, 5” masks, 7” masks, transparencies, shadow masking, or just flood exposure. The tooling can also be changed out to provide wafer to wafer alignment for wafers that need to be aligned before bonding in the [[SB-6E Bonder]].  
==Capabilities==
<!--A more general description of what the tool is capable of doing.-->
* 1-2 µm min feature size resolution in thin resist
* Aspect Ratio 1:3 fairly standard
* Substrate thickness 200 µm to 4 mm possible
* Capable of back side alignment
==Announcements==
*Update this with announcements as necessary
 
==Capabilities==
<!--A more general description of what the tool is capable of doing.-->
* Etch Rate
* Resolution
* Aspect Ratio
* Thickness range
==System overview==
===Hardware detailsDetails===* GasesBroadband light source calibrated to 20 mJ/sec at the 405 nm peak. Total broadband dose about 30 mJ/sec* Pressure4" and 6" chucks* Chuck4", 5" and 7" mask holders* ChamberFlood exposure, soft, hard, and vacuum contact capable* RF / Power SpecsTopside alignment (no backside or bond alignment)* Chemicals10 mm stage travel, 150 mm microscope objective travel with split field view camera option
===Substrate requirements===
* Wafer SizeFull 4" and 6" wafers standard * Wafer typePieces are not allowed in this mask aligner. For pieces use MJB3 instead* Any mounting?Mounting may be necessary if wafer has thru holes, etc. Create helpdesk ticket for assistance* Wafer Substrate thickness200 µm to 4 mm possible
===Material restrictions===
{{material restrictions}}Allowed Materials - LNF approved photoresists Not Allowed Materials - Uncured PDMS and SU-8 (restricted w/out approval)
==Supported processes==
This tool is primarily used to expose photodefinable materials. The lamp output is calibrated to the 405 nm peak at 20 mJ/sec with <!-- We recommend creating a subpage detailing the supported processes for 5% uniformity across the tool, which will be generated if you leave the link below4” area. Alternatively, you may include the information on The 365 peak output is about half of this pageand tracks very well however is not routinely calibrated. In that case We allow 4” masks, the Supported Processes document from the equipment manual can be included here5” masks, 7” masks, transparencies, shadow masking, using {{#widget:GoogleDoc|key=googledocid}} -->or a manually timed flood exposure.
There are several processes for this tool supported by the Exposure of all LNF, which approved photoresists are described in more detail allowed on the [[/Processes/]] page. <!-- If you allow custom recipes, let users know to contact a this tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->In addition to these, this tool has a number of user-created recipes for etching a wide variety of materials. Some of these recipes are documented data on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you are curious if your material can be processed in this tool, specific resist please contact the tool engineers via the helpdesk ticket systemsee that resists wiki page.
==Standard operating procedure==
<!* [https://drive.google.com/file/d/0B3k-qgz56T_4YWJLc2t3ZUJQZ2s/view?usp=sharing&resourcekey=0- To include a document from 54OMu8wX_SgVg3lwk8zSmQ System Overview ]* [https://drive.google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can com/file/d/0B3k-qgz56T_4WXo4VFVnWjI4R0k/view". -?usp=sharing&resourcekey=0->A8jY9b2Rzqq1OYCmiI7r_w Topside Mask Alignment SOP]{{#widget* [https:GoogleDoc|key//drive.google.com/file/d/0B3k-qgz56T_4dTk2NlRQalNmMUk/view?usp=googledocid}}sharing&resourcekey=0-hq5tzpfZ3eoziMnhobUb2w Troubleshooting]
==Checkout procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through this page and the Standard Operating Procedure above.
# Complete the training request form [http://examplelink.com here].
# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training.
# A tool engineer will schedule a time for initial training.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
# Complete the SOP quiz [http://examplelink.com here].
# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
==Maintenance== # Complete a [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again.# Practice on the tool with your mentor.# Read through the User Manual above.# Accurately complete the [https://docs.google.com/a/lnf.umich.edu/forms/d/1L5TToo8m1ZaTqTK5p8UJ6gEcPR_8UFawA21pygwi_34/viewform checkout quiz]. You may retake as necessary until all answers are correct.# Schedule a time for a checkout:<!-## Find an available time for checkout [https://calendly.com/lnf- Describe standard maintenancelithography/qualification tests here contact-aligner->checkout here]. ===Process name===<!## Verify that the tool is available in the [https://ssel-- This is an example a chart published with etch datasched.eecs.umich. You can just replace the url with your ownedu/sselscheduler/ResourceDayWeek. aspx?Path=0-0-0->{{#widgetvar:Iframetoolid}} LNF Online Services] at the time you are requesting.|url=chart url## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.|width# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=800|height=400|border3&path=0:0:0:{{#var:toolid}}helpdesk ticket] for final confirmation of your checkout appointment.# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser, Bureaucrats, Interface administrators, Administrators, Widget editors
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