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ACS 200 cluster tool

1,134 bytes added, 1 year ago
--> {{#vardefine:toolid|54040}} <!--
Set the Process Technology (see subcategories on Equipment page)
--> {{#vardefine:technology|Lithography spin coating/developing}} <!--
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals
--> {{#vardefine:restriction|2}}
{{infobox equipment
|caption =
|materials = spr [[SPR 220]], 1813[[SPR 955|SPR 955 0.9]], and LNF approved photo resist syringes
|mask =
|size =
|chemicals = MF300[[MF 300]], MF319[[MF 319]], [[EBR]], [[Acetone]], [[HMDS]]
|gases =
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
|sop = [ SOP]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
 The [[{{warning|This page has not been released yet.PAGENAME}} <!-- Insert the ]] is an automated [[photoresist]] [[Lithography|coating, baking, vapor prime, stripping and developing]] tool description here . It can run full 4" and 6" cassettes of up to 25 wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps [[SPR 220]]--> ==Announcements==*Update this (3.0) and [[SPR 955]] photoresists. Other resists can be set up to automatically dispense from a syringe. The spinner's closed lid option can help aid with announcements as necessarymore uniform sidewall coating. [[HMDS]] is applied via vapor prime. Both developers are CMOS compatible ([[MF 319]], and [[MF 300]]). The developer temperature is controlled to within 0.1°C throughout the process.
* Automated spin coating
* Automated spray developing
* Automated vapor prime
* Photoresist stripping
* 4" and 6" wafers
{{note|[[PMMA]] and other e-beam resists should be processed in [[Photoresist Bench 31]] in 1480A|reminder}}
===Hardware details===
* RC-8 spin coater with gyrset closed cover option
* Spinner equipped with back side rinse arm for 4" wafers only
* 4" chuck will accommodate 6"
* spr [[SPR 220]]-(3.0) and 1813 [[SPR 955|SPR 955 0.9]] photo resists automatically dispensed.
* All other approved resists can be coated with EFD dispense option.
* Spray develop module fitted with MF300 [[MF 300]] and MF319[[MF 319]]* Hot plate ovens and [[HMDS ]] [[vapor prime ]] chamber
* Fully automated robot handling
===Substrate requirements===
* 4" and 6" wafers
* glass Glass wafers not preferred for baking
===Material restrictions===
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/SPR 220]] pageand [[SPR 955]] pages.The tool is already equipped with various recipes for spin coating at different thicknesses, developing at different times and baking at different temperatures. If the tool is not equipped with a recipe that you need, then please create a helpdesk ticket.
<!-- If you allow custom recipes, let users know to contact a tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->
<!-- In addition to these, this tool has users can create a helpdesk ticket requesting a number modification of user-created one of the standard recipes for etching by a wide variety of materialstool engineer. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.-->
==Standard operating procedure==
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
==Checkout procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through this page and the Standard Operating Procedure above.
# Practice with your mentor or another authorized user until you are comfortable with tool operation.
# Create a [{{#var:toolid}} Helpdesk Ticket] requesting training/checkout.
# A tool engineer will schedule a time for training/checkout
==Maintenance== # Complete spinner clean and conditioning are done semi annually or as neededa [[Lithography training session]]. If you have already completed this for another tool, you do not need to complete it again.Fluid and resist fills are done/checked weekly# Practice on the tool with your mentor.Hot plate ovens checked bi weekly and cleaned as needed# Read through the User Manual above.Spray develop checked weekly and maintained as needed# Accurately complete the [ checkout quiz].Robot training performed annually or You may retake as needednecessary until all answers are correct.# Schedule a time for a checkout:===Process name===<!## Find an available time for checkout [ This checkout here].## Verify that the tool is an example a chart published with etch dataavailable in the [https://ssel-sched.eecs.umich. You can just replace the url with your ownedu/sselscheduler/ResourceDayWeek. aspx?Path=0-0-0->{{#widgetvar:Iframetoolid}} LNF Online Services] at the time you are requesting.|url=chart url## After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.|width# Create a [|height=400|border3&path=0:0:0:{{#var:toolid}}helpdesk ticket] for final confirmation of your checkout appointment.# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser


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