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SB-6E Bonder

43 bytes removed, 1 year ago
--> {{#vardefine:toolid|141031}} <!--
Set the Process Technology (see subcategories on Equipment page)
--> {{#vardefine:technology|substrate bonderWafer bonding}} <!--
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals
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{{infobox equipment
|caption =
|materials = silicon, glass
|mask =
|size =4" with 6" tooling available by request
|gases =
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
|sop = [https://link.to SOP]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
{{warning|This page has not been released yet.}}
This tool is used to bond 4" wafers, (and in some circumstances be configured for 6" wafers). It is primarily used for [[Anodic bonding |anodic bonding]] and has superior anodic bond hardware when compared to our other bonders. Other types of bonds are allowed, but a helpdesk ticket should be created and the process discussed with one of the tool engineers. Anodic power supply polarity is reversible and the top electrode is capable of tack bonding in the center prior to full wafer bonding.
*Update this with announcements as necessary
<!--A more general description of what the tool is capable of doing.-->
* Chamber vacuum below 5.0e-5mbar 5 mbar easily achieved* Tool force of 30kN 30 kN * Max chuck temp of 550 degrees C500°C* Substrate stack thicknesses of 500um 500 um to 5mm 5 mm possible. Thinner or thicker with tool engineer approval.
==System overview==
===Hardware details===
* GasesUp to 500 °C chuck temp* 30 kN tool Pressure* 4" Chuck, 6" available by request* Chamberpressure below 5.0 e-5 mbar. Positive chamber pressure also available* RF / Power Specs* ChemicalsN2 atmosphere possible in chamber
===Substrate requirements===
* Wafer Size* Wafer type4" round. 6" round by request* Any mounting?Si and glass wafers allowed* Wafer thicknessbetween 500 µm and 5 mm with tool engineer discussion
===Material restrictions===
{{note|The approved materials listed for the {{PAGENAME}} are restricted to those that can come into surface with the tooling. There are several exceptions that are allowed within the bond interface, depending on the type of bond used. Some of these can be found in the [[#supported processes]] section. For any other materials, please create a helpdesk ticket. }}
{{material restrictions}}
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.
<!-- If you allow custom recipes, let users know Anodic bonding of Si to contact a glass is primarily supported on this tool engineer, and you may also create the link below which will create a page that users can add custom recipes to. -->In addition to these, this tool has a number of user-created recipes for etching a wide variety of Other materials. Some of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]allowed for other bonds also if requested. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system. <!--There are several processes for this tool supported by the LNF, which are described in more detail on the [[/Processes/]] page.-->
==Standard operating procedure==
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through this page and the Standard Operating Procedure above.
# Complete the training request form [ here].# Create a [{{#var:toolid}} Helpdesk Ticket] requesting training, and to review your process needs.# A tool engineer will schedule Create a time for initial training.# Practice with your mentor or another authorized user until you are comfortable with tool operation.# Complete the SOP quiz [ here]eecs.# Schedule a checkout session with a tool engineer via the helpdesk ticket systemumich. If this checkout is successful, the engineer will authorize you on the tooledu/sselScheduler/ResourceContactaspx?tabindex=3&path=Maintenance== <!-- Describe standard maintenance/qualification tests here --> ===Process name===<!-- This is an example a chart published with etch data. You can just replace the url with your own. -->0:0:0:{{#widgetvar:Iframe|url=chart url|width=800|height=400|border=0toolid}}helpdesk ticket] requesting checkout.# Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.
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