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NP12 nanoPREP

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--> {{#vardefine:toolid|143001}} <!--
Set the Process Technology (see subcategories on Equipment page)
--> {{#vardefine:technology|Plasma Activationactivation}} <!--
Set the Material Restriction Level: 1 = CMOS Clean, 2 = Semi-Clean, 3 = Metals
--> {{#vardefine:restriction|2}}
|gases =
|overview = [[{{PAGENAME}}#System_overview | System Overview]]
|sop = [https://https://docs.google.com/document/d/1SpYgBOOTt9VrZB0aEVttLnIHDeG4bn4czIIwfaIznk4/preview SOP]
|processes = [[{{PAGENAME}}/Processes|Supported Processes]]
|userprocesses = [[LNF_User:{{PAGENAME}}_user_processes|User Processes]]
|maintenance = [[{{PAGENAME}}#Maintenance | Maintenance]]
}}
The nP12 is an atmospheric plasma tool that generates a N<sub>2</sub> plasma which scans over the wafer surface. It is used for wafer surface modification, usually [[Plasma_activation|plasma activation]] prior to [[Wafer_bonding|wafer bonding]]. Plasma activation helps to reduce the necessary bonding temperatures in many materials and enables [[Fusion_bonding|fusion bonding]] of [[Silicon|si]] substrates.
{{warning|This page has not been released yet.}}
 
This tool is an atmospheric plasma tool that generates a N2 plasma which scans over the wafer surface. It is used for wafer surface modification. Usually plasma activation prior to wafer bonding. Plasma activation helps to reduce successful bonding temperatures in many materials and enables fusion bonding of Si substrates.
 
==Announcements==
*Update this with announcements as necessary
==Capabilities==
<!--A more general description of what the tool is capable of doing.-->
* 500 W direct N2 N<sub>2</sub> plasma* programmable Programmable scan speed and dose* adjustable Adjustable for various substrate thicknesses up to several mm* wafers Wafers from 10 mm pieces up to 12" 300 mm diameter
==System overview==
===Hardware details===
* N2 N<sub>2</sub> plasma
* Plasma scan of substrate surface is at atmosphere
* Programmable plasma power
===Substrate requirements===
* 10 mm pieces up to 12" 300 mm diameter wafers* Any non restricted substrate materials
* Mounting may be advisable. Discuss with a tool engineer
* Standard wafer thicknesses preferred, but wafer thickness of several mm can be adjusted for
==Supported processes==
<!-- We recommend creating a subpage detailing the supported processes for the tool, which will be generated if you leave the link below. Alternatively, you may include the information on this page. In that case, the Supported Processes document from the equipment manual can be included here, using {{#widget:GoogleDoc|key=googledocid}} -->
 There are several processes for this This tool supported by the LNF, which are described in more detail on the [[/Processes/]] page. <!-- If you allow custom recipes, let users know is primarily used to contact a tool engineer, and you may also create plasma activate the link below which will create a page that users can add custom recipes to. -->In addition to these, this tool has a number surface of user-created recipes Si substrates for etching a wide variety direct wafer bonding, however it will perform surface modification of many materials. Some Here is a chart of these recipes are documented on [[LNF User:{{BASEPAGENAME}} User Processes|{{BASEPAGENAME}} user processes]]characterized materials and their surface energy over time. If you are curious if your material can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.{{disputed-section}}
==Standard operating procedure==
{{cleanup-manual}}
<!-- To include a document from google docs, use the line below, replace "googledocid" with the ID for the document. Remember, to make this visible, you must set Sharing for the document to "Anyone with the link can view". -->
{{#widget:GoogleDoc|key=1SpYgBOOTt9VrZB0aEVttLnIHDeG4bn4czIIwfaIznk4}}
<!-- Describe the checkout procedure for the tool. For example: -->
# Read through this page and the Standard Operating Procedure above.
# Complete Ideally practice with your mentor or another authorized user operating the training request form [http://examplelink.com here]tool.# Create a [http://ssel-sched.eecs.umich.edu/sselScheduler/ResourceContact.aspx?tabindex=3&path=0:0:0:{{#var:toolid}} Helpdesk Ticket] requesting training/checkout.# A tool engineer will schedule a time for initial training.# Practice with your mentor or another authorized user until you are comfortable with tool operation.# Complete the SOP quiz [http://examplelink.com here].# Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the tool.
==Maintenance==
<!-- Describe standard maintenance/qualification tests here --> ===Process name===<!-- This *Test wafers are run monthly and the static contact angle of water on the surface is an example a chart published with etch data. You can just replace the url with your own. -->{{#widget:Iframe|url=chart url|width=800checked|*The scan head height=400|border=0}}is checked or adjusted as needed
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