Jump to navigation Jump to search

Sputter deposition

80 bytes removed, 6 years ago
no edit summary
{{infobox equipment
|image = [[File:Sputter Deposition.png|center|300px]]
|caption =
|materials = [[Silver|Ag]], [[Aluminum|Al]], [[Aluminum oxide|Al2O3]], [[Gold|Au]], [[Chromium|Cr]], [[Copper|Cu]], [[Iron|Fe]], [[Germanium|Ge]], [[Nickel|Ni]], [[Platinum|Pt]], [[Silicon dioxide|SiO2]], [[Titanium|Ti]], [[Titanium dioxide|TiO2]], [[Zinc|Zn]]
{{warning|This page has not been released yet.}}
[[Wikipedia:Sputter_deposition|Sputter Deposition]] is a physical vapor deposition (PVD) method of thin film deposition in which a high-purity source material (called a cathode or target) is subjected to a gas plasma (typically Ar.) The energetic atoms in this gas plasma collide with the target material and knock off source atoms which then travel to the substrate and condense into a thin film.
LabUser, OnlineAccess, PhysicalAccess, Staff, StoreManager, StoreUser


Navigation menu