Spin Rinse Dryer

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Spin Rinse Dryer

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            Spin Rinse Dryer
Equipment Details
Technology Process Technology
Materials Restriction Undefined
Material Processed wafers
Sample Size 4" or 6"
Chemicals Used DI water
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Supported Processes
User Processes User Processes
Maintenance Maintenance


The Spin Rinse Dryer or SRD is a tool used for cleaning, rinsing, and drying wafers after wet processing. The SRDs are single cassette, front-loading rinser/dryers capable of rinsing either 4" or 6" wafers. After being rinsed with DI water, the cassettes are dried primarily through spinning while liquid droplets on the bowl are evaporated using heated Nitrogen.

Announcements

The Acid 92 and RCA 81 Spin Rinse Dryers have been sent to Sitek for maintenance

Capabilities

The SRD can spin, rinse, and dry semiconductor wafers without leaving water spots and films after a wet process. Spin Rinse Dryers use DI water that is set to a resistivity setpoint of 16.0.

Recipe 0: Rinse recipe Recipe 1: Standard rinse and dry Recipe 2: Standard rinse and slow dry

Always run Recipe 0 before using any of the CMOS clean Spin Rinse Dryers.

SRDs Available

The following is a list of SRDs that are available in both the cleanroom and the ROBIN lab.

S/N 13871

  • OFFLINE
  • Location: ROBIN Lab 1436
  • Associated Benches: Acid Bench 92
  • 4" wafers
  • Single Recipe Available

SRD-81-1440A

  • OFFLINE
  • RCA clean only
  • Location: 1440A
  • Associated Benches: RCA Bench 81
  • 4" wafers
  • Single recipe available

B-SRD-82-1440A B

B-SRD-82-1440A B

SRD-71-1440B

SRD-11-1480B

SRD-12-1480B

SRD-01-1480C

  • PFC only
  • Location: 1480C
  • Associated Benches: PFC Bench 01
  • 6" wafers

SRD-02-1480C

  • PFC only
  • Location: 1480C
  • Associated Benches: PFC Bench 01
  • 4" wafers

SRD-03-1480C

SRD-04-1480C

Material restrictions

SRD-81-1440A is considered semi-clean and is used for substrates which 1) do not need to go into the furnaces, or 2) have been been through the non-CMOS-clean processes of chemical mechanical polishing, KOH etch, or AZ 400K developer, or which need to go back into furnaces.

SRD-01-1480C and SRD-02-1480C are considered CMOS-clean. Silicon substrates, high purity fused silica, and CMOS-clean furnace-grown silicon, silicon dioxide, and silicon nitride thin films are allowed in this SRD. No metals, photoresist or glass wafers (except high purity fused silica) are allowed. Wafers are not allowed in this SRD or in the furnaces if they have ever had metal on them. SRD 01 and 02 are only to be used to process wafers that are on the last step of the PFC process.

Silicon wafers that have been processed in non-CMOS-clean chemicals and tools are not allowed. Wafers that have been processed through any wet benches other than Acid 02 or RCA 81 cannot be cleaned in PFC 01.

Supported processes

There are several standard recipes that are set up for this tool and supported by the LNF, which are described in more detail below. Recipe 0 is used to clean the SRD. Recipe 1 is the standard rinse and dry recipe. Recipe 2 is a slow recipe used for fragile wafers.

The quick reference guide to using the SRD is found below: Widget text will go here.

If you are curious if your recipe can be processed in this tool, please contact the tool engineers via the helpdesk ticket system.

Checkout procedure

  1. Read through this page and the corresponding bench wiki page.
  2. Create a Helpdesk ticket requesting training for the corresponding bench.
  3. A tool engineer will schedule a time for initial training.
  4. Practice with your mentor or another authorized user until you are comfortable with tool operation.
  5. Schedule a checkout session with a tool engineer via the helpdesk ticket system. If this checkout is successful, the engineer will authorize you on the bench and the corresponding SRD.

Maintenance

The following is a list of common HELP errors that can occur on the SRD.

Use Recipe 0 before use to rinse out the tank


Widget text will go here.