TEL Mark Vz Coater

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TEL Mark Vz Coater
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Equipment Details
Technology Lithography
Materials Restriction General
Material Processed SPR 220, SPR 955
Chemicals Used AZ 726, AZ 300, EBR, HMDS
Equipment Manual
Overview System Overview


The TEL Mark Vz Coater is an automated photoresist coating, baking, vapor prime, stripping and developing tool. It can run full 4" and 6" cassettes of up to 25 wafers at a time. It's capable of having multiple paths running simultaneously (ie., coating and developing from two different cassettes). It automatically pumps SPR 220-(3.0) and SPR 955 photoresists. HMDS is applied via vapor prime. Both developers are CMOS compatible (AZ 726, and AZ 300). The developer temperature, photoresist temperature, developer and spinner motor flanges are controlled to within 0.1°C throughout the process. The spinner also has a temperature and humidity unit. It is located in 1450.

Capabilities

  • Automated handling of 4" and 6" wafers
  • HMDS Vapor Prime
  • Spin coating
  • Spray and puddle developing

System overview

Hardware details

  • SPR 220 (3.0) and SPR 955 (0.9) spinning
  • Topside and Backside EBR
  • Temperature and Humidity controlled spinner
  • AZ 726 puddle and AZ 300 continuous spray developing
  • 3 hotplates and 3 coldplates
  • HMDS vapor prime oven with dedicated cold plate
  • Fully automated robot handling
  • Two 100mm elevators & two 150mm elevators

Substrate requirements

  • 4" and 6" wafers
  • Glass wafers are okay
  • 200 µm to 1000 µm (outside of this range make a ticket)
  • No through holes
  • No photoresist on the backside of the wafer

Material restrictions

The TEL Mark Vz Coater is designated as a General class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.


Supported processes

A variety of rpin and develop recipes are available ot the system, including:

  • SPR 220: 2 µm, 3 µm, and 5 µm
  • SPR 955: 0.97 µm
  • AZ 726: Puddle develop from 5 sec to 2 min
  • AZ 300: Continuous spray develop from 2 sec to 45 sec

Please see the [Equipment Manual] for detailed descriptions of recipes

See below for photoresist thicknesses for a cassette of 25 4 in wafers

Resist Average Thickness Uniformity
SPR 955 0.9720 µm ± 0.12% 0.18%
SPR 220 3.0092 µm ± 0.38% 0.14%


Standard operating procedure

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Checkout procedure

  1. Complete a Lithography training session. If you have already completed this for another tool, you do not need to complete it again.
  2. Read through the User Manual above.
  3. Accurately complete the checkout quiz. You may retake as necessary until all answers are correct.
  4. Schedule a time for a checkout:
    1. Find an available time for checkout here.
    2. Verify that the tool is available in the LNF Online Services at the time you are requesting.
    3. After confirmation that the event is scheduled in Calendly, invite the staff member assigned to your event to a Staff Support reservation at that time.
  5. Create a helpdesk ticket for final confirmation of your checkout appointment.
  6. Authorization will be provided pending demonstration of proper tool use in the presence of a tool engineer.