Tempress S1T1 - Annealing

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Tempress S1T1 - Annealing
Equipment Details
Technology Thermal processing
Materials Restriction CMOS Clean
Sample Size 100mm and/or 150mm
Gases Used N2, 5%H2/N2
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes Annealing
Maintenance Maintenance

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. Annealing in metallurgy, and material science, is a heat treatment wherein, a material is altered, causing a change in its properties such as strength, and hardness. It is a process that produces conditions by heating, and maintaining a suitable temperature, and then cooling. Annealing is used to induce softness, relieve internal stress, and to refine the structure.


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System overview

Hardware details

  • N2 - Maximum flow 10 slpm
  • 5% H2/N2 - Maximum flow 10 slpm
  • Maximum temperature 600°C

Substrate requirements

  • Silicon only
  • Can process up to 25, 100mm (4"), and or, 150mm (6") wafers
  • Wafer thickness, 525um for 100mm (4"), and 675um for 150mm (6")

Material restrictions

The Tempress S1T1 - Annealing is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported processes

Process details

Characterization data

  • N/A

Standard operating procedure

Checkout procedure

  1. Create a Help desk Ticket requesting training.
  2. LNF staff will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
  3. Schedule a checkout session with a tool engineer via the existing Helpdesk ticket. If this checkout is successful, the engineer will authorize you on the tool.