Tempress S1T3 - N-type in Situ Doped Poly-Si 6"

From LNF Wiki
Jump to navigation Jump to search
Tempress S1T3 - N-type in Situ Doped Poly-Si 6"
Equipment Details
Technology LPCVD
Materials Restriction CMOS Clean
Sample Size 150mm
Gases Used N2, SiH4, 5% PH3/SiH4
Equipment Manual
Overview System Overview
Operating Procedure SOP
Supported Processes N-type in-situ doped polysilicon
Maintenance Maintenance

The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. In-situ doped polysilicon is formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. Doping is achieved by adding dopant gases such as PH3 (N-type), or BCl3 (P-type) to the deposition gases. The important factors are gas ratio, temperature, and pressure.


  • The tool is currently down. The bottle of PH3/SiH4 is the wrong mix and will not work in the tool. A new bottle has been ordered and is expected to arrive by the end of June.


System overview

Hardware details

  • N2 - Maximum flow 10 slpm
  • SiH4 - Maximum flow 300 sccm
  • 5% PH3/SiH4 - Maximum flow 100 sccm

Substrate requirements

  • Silicon only
  • Can process up to 25, 150 mm (6") wafers
  • Wafer thickness, ~675um for 150mm (6")
All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S1T3 - N-type in Situ Doped Poly-Si 6" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported processes

Process details

Characterization data

Standard operating procedure

Checkout procedure

  1. Create a Help desk Ticket requesting training.
  2. LNF staff will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
  3. Schedule a checkout session with a tool engineer via the existing Helpdesk ticket. If this checkout is successful, the engineer will authorize you on the tool.


  • Maintenance is performed on the tool, after 20µm of accumulated deposition.
  • Maintenance consists of replacing the following quartz parts within the tube.
    • Cage
    • Twin rods
    • Bridge for twin rods
    • Injector
    • Dummy wafers
  • Tube is replaced at 100µm of accumulated deposition.