Tempress S2T1 Storage 4" & 6"

Tempress S2T1 Storage 4" & 6"
Equipment Details
Technology	Process Technology
Materials Restriction	CMOS Clean
Sample Size	100mm and/or 150mm
Gases Used	N2
Equipment Manual
Overview	System Overview
Maintenance	Maintenance

The Tempress S2T1 Storage 4" & 6" is used as a storage furnace for wafers/samples that have gone through the RCA pre-furnace clean procedure, prior to any clean furnace run. The wafers are stored in a Nitrogen ambient, at a temperature of 350°C.

Announcements

• No announcements at this time.

Capabilities

• Wafer storage

System overview

Hardware details

• N₂ - Maximum flow 10 slpm
• Temperature - 350°C

Substrate requirements

• Can process up to 25, 100mm (4"), and or, 150mm (6") wafers
• Wafer thickness, 525um for 100mm (4"), and 675um for 150mm (6")
• Maximum storage time is 72 hours

All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S2T1 Storage 4" & 6" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

• Wafer storage

Process Details

• N/A

Characterization Data

• N/A

Standard operating procedure

• N/A

Checkout procedure

1. Complete training and checkout on any of the other Tempress furnaces and the storage tube can be added if requested. Additional training is not necessary.

Maintenance

• TransLC clean - Once per year.