Tempress S2T1 Storage 4" & 6"

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Tempress S2T1 Storage 4" & 6"
Equipment Details
Technology Process Technology
Materials Restriction CMOS Clean
Sample Size 100mm and/or 150mm
Gases Used N2
Equipment Manual
Overview System Overview
Maintenance Maintenance

The Tempress S2T1 Storage 4" & 6" is used as a storage furnace for wafers/samples that have gone through the RCA pre-furnace clean procedure, prior to any clean furnace run. The wafers are stored in a Nitrogen ambient, at a temperature of 350°C.


  • No announcements at this time.


  • Wafer storage

System overview

Hardware details

  • N2 - Maximum flow 10 slpm
  • Temperature - 350°C

Substrate requirements

  • Can process up to 25, 100mm (4"), and or, 150mm (6") wafers
  • Wafer thickness, 525um for 100mm (4"), and 675um for 150mm (6")
  • Maximum storage time is 72 hours
All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S2T1 Storage 4" & 6" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Supported processes

  • Wafer storage

Process Details

  • N/A

Characterization Data

  • N/A

Standard operating procedure

  • N/A

Checkout procedure

  1. Complete training and checkout on any of the other Tempress furnaces and the storage tube can be added if requested. Additional training is not necessary.