Tempress S2T1 Storage 4" & 6"

Tempress S2T1 Storage 4" & 6"
Equipment Details
Technology	Process Technology
Materials Restriction	CMOS Clean
Sample Size	Pieces up to 150mm (6")
Gases Used	N2
Equipment Manual
Overview	System Overview
Maintenance	Maintenance

The Tempress S2T1 Storage 4" & 6" is used as a storage furnace for wafers/samples that have gone through the RCA pre-furnace clean procedure, prior to any clean furnace run. The wafers are stored in a Nitrogen ambient, at a temperature of 350°C.

Announcements

• New wands - Vespel is a softer material and should do less damage to double sided polished wafers. The drawback to Vespel is that it can't take as much heat as a quartz wand tip. The maximum sustainable temperature for Vespel is 288C. So make sure you allow enough time for the wafers to cool prior to handling them. Once the boat has traveled all the way out of the tube you will need at least 10 minutes for the storage tube and a minimum of 15 minutes for tubes

Capabilities

• Wafer storage

System overview

Hardware details

• N₂ - Maximum flow 10 slpm
• Temperature - 350°C

Substrate requirements

• Pieces up to 150mm (6")
• Maximum storage time is 72 hours

All samples must go through the RCA Pre-Furnace clean procedure before being processed in the furnace

Material restrictions

The Tempress S2T1 Storage 4" & 6" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.

Approved materials

Supported processes

• Wafer storage

Process Details

• N/A

Characterization Data

• N/A

Standard operating procedure

• N/A

Checkout procedure

1. Complete training and checkout on any of the other Tempress furnaces and the storage tube can be added if requested. Additional training is not necessary.

Maintenance

• TransLC clean - Once per year.