Tempress S2T4 - Low Stress Nitride 4"
| Tempress S2T4 - Low Stress Nitride 4" | |
|---|---|
 | |
| Equipment Details | |
| Technology | LPCVD |
| Materials Restriction | CMOS Clean |
| Sample Size | Pieces up to 100 mm (4") |
| Gases Used | N2, SiH2Cl2, NH3 |
| Equipment Manual | |
| Overview | System Overview |
| Operating Procedure | SOP |
| Supported Processes | Low-stress Nitride |
| Maintenance | Maintenance |
The Tempress diffusion system is a modular horizontal furnace designed to process silicon wafers as part of the manufacturing technology of semiconductor, optical, MEMS, and solar devices. Low-stress Nitride is formed by using a process called LPCVD, Low Pressure Chemical Vapor Deposition. Chemical vapor deposition forms thin films on the surface of a substrate by thermal decomposition and/or reaction of gaseous compounds. The desired material is deposited directly from the gas phase onto the surface of the wafer. The important factors are gas ratio, temperature, and pressure. By changing the temperature, gas flows, and gas ratio, we can achieve a very low stress Nitride film.
Contents
Announcements
- New wands - Vespel is a softer material and should do less damage to double sided polished wafers. The drawback to Vespel is that it can't take as much heat as a quartz wand tip. The maximum sustainable temperature for Vespel is 288C. So make sure you allow enough time for the wafers to cool prior to handling them. Once the boat has traveled all the way out of the tube you will need at least 10 minutes for the storage tube and a minimum of 15 minutes for tubes
Capabilities
- Low Stress Nitride (LSN)
- Maximum Thickness - 2µm
System overview
Hardware details
Substrate requirements
- Silicon only
- Pieces up to 100 mm (4")
- Can process up to 25, 100 mm (4") wafers
Material restrictions
The Tempress S2T4 - Low Stress Nitride 4" is designated as a CMOS Clean class tool. Below is a list of approved materials for the tool. Approved means the material is allowed in the tool under normal circumstances. If a material is not listed, please create a helpdesk ticket or email info@lnf.umich.edu for any material requests or questions.
Supported processes
- Low Stress Nitride (LSN)
Process details
Characterization data
Standard operating procedure
Checkout procedure
- Create a Help desk Ticket requesting training.
- A process engineer will schedule a time for initial training. After completing training the user can attempt a checkout session. It may be necessary for some users to participate in more than one training session, prior to attempting check out.
- Schedule a checkout session with a tool engineer via the Help desk Ticket system. If this checkout is successful, the engineer will authorize you on the tool.
Maintenance
- Paddle - cleaned every 3-6µm of accumulated deposition.
- Boats, and dummy wafers are replaced every 3-6µm of accumulated deposition.
- Tube is replaced at 100µm of accumulated deposition.
